Skip to content
No results
  • HOME
  • About
  • Equipment
    • Chip Bonding Equipment
    • Surface Treatment Equipment
    • Wafer Bonding Equipment
  • Foundry Service
  • News
  • Contact us
  • English
    • 中文 (台灣)
    • English
    • 日本語
青輝半導體
  • HOME
  • About
  • Equipment
    • Chip Bonding Equipment
    • Surface Treatment Equipment
    • Wafer Bonding Equipment
  • Foundry Service
  • News
  • Contact us
  • English
    • 中文 (台灣)
    • English
    • 日本語
青輝半導體

Month September 2025

Seiki Semiconductor Debuts Localized Hybrid Bonding System, Targets 2026 Growth

青輝半導體(Seiki Semiconductor)於2025國際半導體展(9/10)宣布,成功推出首款在地化自主研發的「混合鍵封裝機台」
  • 2025 年 9 月 10 日

Contact

HSIN-CHU (Operation Center)

No.32, Guangfu Road, Hukou TownShip, Hsinchu

County 303036, Taiwan

  • Email:Jurgen.yeh@seikisemi.com
  • Office +886-3-597-3083 #3383
  • MP +886-922260881
  • Home
  • About
  • Equipment
  • Contract Manufacturing
  • News
  • Contact

建議使用 1920x1080 解析度來瀏覽本站 © 2025 青輝半導體