Taiwan’s advanced packaging equipment supply chain has reached a major milestone. At SEMICON Taiwan 2025 (September 10), Seiki Semiconductor announced the successful launch of its first locally developed, fully in-house hybrid bonding packaging system. Leveraging two core technologies—low-temperature plasma surface activation and atomic-level surface treatment—the system effectively addresses long-standing industry pain points, including prolonged lead times and limited customization offered…

In advanced packaging, reliable bonding between homogeneous materials, heterogeneous materials, and hybrid material systems remains a fundamental technical challenge. In addition, achieving bonding at low temperatures is critically important in order to minimize issues arising from mismatches in mechanical properties, such as coefficient of thermal expansion (CTE) mismatch, between the bonded materials. Surface-activated bonding (SAB) based on plasma surface activation…