Taiwan’s advanced packaging equipment supply chain has reached a major milestone. At SEMICON Taiwan 2025 (September 10), Seiki Semiconductor announced the successful launch of its first locally developed, fully in-house hybrid bonding packaging system. Leveraging two core technologies—low-temperature plasma surface activation and atomic-level surface treatment—the system effectively addresses long-standing industry pain points, including prolonged lead times and limited customization offered by incumbent international equipment suppliers.
The newly introduced platform supports both large-format Wafer-to-Wafer (W2W) and small-format Chip-to-Wafer (C2W) advanced packaging processes. It is currently undergoing sample qualification and evaluation by multiple leading domestic semiconductor manufacturers. Seiki Semiconductor anticipates significant revenue growth from this platform in the coming years.
📌 Key Technological Advantages
Hybrid bonding has emerged as an essential technology for ultra-high-density interconnects, driven by the need for advanced heterogeneous integration in AI, HPC, and other compute-intensive applications. The key competitive advantages of Seiki Semiconductor’s hybrid bonding system include:
Low-Temperature Plasma Activation: A proprietary low-temperature plasma surface activation technology delivers gentle, efficient surface preparation, enhancing bonding success rates and overall yield.
Atomic-Level Surface Treatment: Precision processing achieves superior interfacial flatness, enabling finer bonding pitches to meet the demands of next-generation 3D stacked devices
Process Flexibility: The system is designed to flexibly support both Wafer-to-Wafer processes (commonly used in memory stacking) and Chip-to-Wafer processes (critical for chiplet integration), offering high process compatibility across advanced packaging applications.
📈 Addressing Market Pain Points Through Localization
Historically, Taiwan’s OSATs and foundries have been constrained by the dominance of international equipment suppliers when deploying advanced hybrid bonding tools. According to Dr. Jurgen Yeh, General Manager of Seiki Semiconductor, the value of a localized supply chain lies in directly resolving these challenges:
“We have a deep understanding of our customers’ supply-chain pain points. Lead times for international equipment often extend from one year to eighteen months, with limited willingness to accommodate customer-specific customization. Seiki delivers a differentiated approach—combining localized production with robust customization and rapid response support.”
Seiki Semiconductor emphasized that its localized service model can significantly shorten customer qualification and ramp-up cycles, a critical advantage for domestic OSATs and foundries competing in the global AI chip race. The system has already attracted strong interest from several leading Taiwanese semiconductor companies and is currently undergoing active qualification, with production deployment expected as early as next year.
🌐 Strengthening Taiwan’s Supply Chain Toward Strategic Technology Leadership
The introduction of Seiki Semiconductor’s hybrid bonding system represents a meaningful step toward greater supply chain resilience in Taiwan’s advanced packaging sector. It underscores the island’s evolving role from technology adopter to innovative contributor in high-end equipment. Company representatives stated:
“This platform signifies an important shift in Taiwan’s premium equipment ecosystem—from follower to provider of enabling technologies. We are committed to collaborating closely with local partners to solidify Taiwan’s leadership in the global advanced packaging landscape.”
Moving forward, Seiki Semiconductor plans continued investment in R&D to maintain alignment with industry frontrunners, positioning itself as a highly flexible and customer-focused supplier in the worldwide advanced packaging equipment market.
