Foundry Services
Process Foundry Services
We provide high-quality heterogeneous bonding material foundry services and full wafer-processing solutions, covering 4/6/8/12-inch wafers. Our capabilities support SOI, POI piezoelectric films, SiC (mono-mono and mono-poly), optical TFLN/TFLT, SiCOI, diamond heterogeneous bonding, and other customized bonded substrates.
Customized Solutions
We design tailored process flows based on customer requirements, supporting material compatibility and process optimization.。
Technical Consultation
We provide comprehensive technical support in semiconductor process design, failure analysis, and related engineering services.