Our story
About us (English)
Advanced bonding technologies, Qinghui Semiconductor is committed to technological innovation. Our groundbreaking technological solutions have addressed industry challenges, filled domestic gaps, and earned the trust of leading industry partners. We will continuously improve our R&D capabilities and market competitiveness, providing superior bonding solutions to drive the sustainable growth of the semiconductor industry. Qinghui Semiconductor’s technologies are widely used in advanced fields such as material bonding, sensing, communication, logic computing, memory, and optoelectronic display semiconductor devices.
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Technical advantages
1. Ultra-high vacuum technology
Activation and alignment processes were completed in an ultra-high vacuum environment, overcoming the challenges posed by vacuum.
4. Temperature and pressure control technology
Ensure uniformity under high temperature and high pressure
2. Surface activation technology
We have mastered a complete set of surface activation technologies, including ICP, CCP, and FAB, which can cover all bonding equipment scenarios.
5. Single-piece spin coating/cleaning technology
High-speed rotational dynamic balancing prevents backsplash contamination and ensures high bonding yield.
3. Submicron precision alignment technology
Master mainstream submicron alignment technologies such as Face to Face, inter-chip coaxial, and infrared transmission.
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